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 FREQUENCY
QESM07
SMD 3.0x2.5 Crystal - Ceramic SMD packaged
Specification (Rev-A)
Electrical Characteristics ......................................................P01 ESR vs. frequency range and Mode of vibration ..................P01 Mechanical Characteristics ...................................................P01 Ordering Information .............................................................P02 Suggested Reflow Soldering profile ......................................P02 Tape Drawing........................................................................P03 Reel Drawing ........................................................................P03
Frequency
QESM07
SMD 3.2x2.5 Crystal - Ceramic SMD packaged
Specification (rev-A) June 26th, 2006
Electrical Characteristics
Electrical Parameters Frequency range Temperature Stability Operating Temperature Range Storage temperature range Shunt capacitance C0 Load capacitance Drive level Aging (First Year) Insulator resistance Unit MHz ppm C C pF pF W ppm M 500 10 8pF ~ 12pF 100 300 2 Ref at 25C At 100VDC Customized specification upon request -40 Minimum Typical Maximum 13 10 10 15 15 -20/+70 54 30 30 -40/+85 +85 3.0 Refer to Ordering Information Refer to Ordering Information Refer to Ordering Information Refer to Ordering Information Test conditions
Frequency Tolerance (at 25C) ppm
ESR vs. frequency range and Mode of vibration
Frequency range (MHz) 13.000 to 19.999 20.000 to 25.999 26.000 to 54.000 Mode of vibration Fundamental (AT-cut) Fundamental (AT-cut) Fundamental (AT-cut) Max ESR () 80 70 50
Mechanical Characteristics
Line 1 Line 2 Marking for QESM06 Temex code (3 digits) T+date code (2digits)
Mechanical conditions Vibration 10g, 10Hz to 2KHz according to standard CEI 68-2-63 Shocks 100g, 6ms according to standard CEI 68-227
Note 1 : Pin 2 and Pin 4 are connected through cover. In case connected to GND, frequency might be drifted. Note 2 : QESM07 is fully RoHS compliant. H = 0.65 0.10 mm
1
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QESM07
SMD 3.2x2.5 Crystal - Ceramic SMD packaged
Specification (rev-A) June 26th, 2006
Ordering Information
QESM07 1 10 Part numbering system HQ 10 10 14.7456MHZ
Package type
Vibration mode 1=Fundamental
Frequency tolerance
Operating temperature range
Frequency stability
Load Capacitance 10=10pF
Please, enter the value of load capacitance
Nominal Frequency (MHz) Please enter the nominal frequency
SMD Package QESM07 : SMD ceramic 3.2 x 2.5
10=10ppm 20=20ppm 30=30ppm
D=-40C F= -30C H=-20C J=-10C L=0C M=+50C N=+55C O=+60C Q=+70C T=+85C
10=10ppm 20=20ppm 30=30ppm
Suggested Reflow Soldering Profile
2
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QESM07
SMD 3.2x2.5 Crystal - Ceramic SMD packaged
Specification (rev-A) June 26th, 2006
Tape Drawing
Item
Pitch of components Pitch of sprocket hole Length from hole center to component center Width of carrier tape Width of adhesive tape Height of component hole Width of component hole Gap of hold down tape and carrier tape Diameter of sprocket hole Diameter of feed hole Total of tape thickness
Code
P Po P1 W W0 A B W2 Do D1 K
Dimension
4.0 4.0 2.0 8.0 3.5 3.5 2.8 0.5 1.5 1.5 1.0
Tolerance 0.1 0.1 0.1 0.3 0.1 0.1 0.1 0.1 0.05 0.25 0.1
Reel Drawing
9.5 2.5
O21.6
O13.5
Multiple : 2000pcs per reel
O 178 1.6 O 60
3
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.


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